AKASA T5 Thermal Compound 5g CPU Thermal Paste AK-T505-5G
| Product Type | Thermal Compound |
| Volume | 5g |
| Paste Colour | Grey |
£4.76
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AKASA T5 Thermal Compound 5g for Reliable CPU and GPU Cooling
The AKASA T5 Thermal Compound 5g is a high-performance thermal paste designed to improve heat transfer between your CPU or GPU and its heatsink. Engineered for standard desktop systems, it ensures efficient thermal conductivity, helping maintain stable temperatures during everyday computing, gaming, and productivity workloads. With support for multiple applications, this compound is a practical choice for both system builders and PC maintenance users. The AKASA T5 Thermal Compound 5g is formulated to deliver low thermal resistance and consistent performance, making it suitable for a wide range of cooling setups, including air and liquid cooling solutions. Its non-curing and non-electrically conductive properties make it safe and easy to use for all levels of PC users.
Low Thermal Resistance for Efficient Heat Transfer
This thermal compound is designed to minimize thermal resistance between the processor and heatsink, allowing heat to transfer quickly and efficiently. This helps improve cooling performance and system stability under load.
Safe, Non-Conductive, and Reliable Formula
The AKASA T5 Thermal Compound 5g is non-electrically conductive, reducing the risk of short circuits during application. Its non-curing formula ensures immediate performance without waiting time, making it convenient for quick installations and upgrades.
Easy Application with Included Tools
For user convenience, this thermal compound comes with application accessories such as wipes and a spreader. These tools help clean old paste and ensure an even, smooth layer of thermal material for maximum efficiency.
Ideal for Standard PC Builds
Designed for everyday computing systems, the AKASA T5 Thermal Compound 5g is ideal for CPUs and GPUs requiring consistent thermal performance. It supports 10–20 applications, making it a cost-effective maintenance solution.
Key Features of AKASA T5 Thermal Compound 5g
- High-performance thermal compound for CPU and GPU
- Low thermal resistance for efficient heat transfer
- Non-curing and ready-to-use formula
- Electrically non-conductive for safe application
- Includes wipes and a spreader for easy installation
- Suitable for air and liquid cooling systems
- Supports multiple applications (10–20 uses)
- Stable performance across a wide temperature range
Technical Specifications
General Specifications
| Specification | Details |
| Product Name | AKASA T5 Thermal Compound 5g |
| Model Number | AK-T505-5G |
| Application | Thermally Conductive Compound |
| Weight | 5g |
| Colour | Grey |
| Form | Non-curing compound |
| Specific Gravity | 2.6 |
Thermal Performance
| Specification | Details |
| Thermal Conductivity | 4.0 W/mK |
| Thermal Resistance | 0.07°C·cm²/W @ 60 psi |
| Operating Temperature | -50°C to 220°C |
| Viscosity | 4,800,000 mPa·s (22°C) |
Why Choose AKASA T5 Thermal Compound 5g at Prodisk IT?
The AKASA T5 Thermal Compound 5g offers a reliable and easy-to-use solution for maintaining optimal CPU and GPU temperatures. With low thermal resistance, safe non-conductive properties, and included application tools, it ensures efficient heat transfer and hassle-free installation. Whether you’re upgrading your system or performing routine maintenance, this thermal compound provides consistent and dependable cooling performance.
| Weight | 0.02 lbs |
|---|---|
| Manufacturer | |
| EAN | |
| Manufacturer Code |
Manufacturer’s Website:
www.akasa-europe.com
Warranty:
This product carries no warranty. We will only accept returns for damaged or dead on arrival.
FEATURES
| Thermal conductivity | 4 W/m�K |
| Specific gravity | 2.6 g/cm� |
PACKAGING DATA
| Quantity per pack | 1 pc(s) |
WEIGHT & DIMENSIONS
| Weight | 5 g |
